Probe Polishing Process Reduces Carryover by up to Seventy Five Per Cent
Mar 21 2017 Read 500 Times
The DP3® polishing process from Diba Industries, Inc improves the performance of stainless steel and other metallic probes used for IVD and diagnostic instruments. Diba’s proprietary process creates an extremely smooth and durable internal surface that reduces carry-over by up to seventy five per cent.
DP3 polishing can greatly improve surface finish on the internal diameter (ID) of a probe. This reduces microscopic pits where process fluids may collect, minimising the possibility of cross contamination. The surface improvement may also positively impact wash characteristics, thereby reducing cycle time and wash fluid costs. Unlike similar processes, which apply a coating that can flake off over time, DP3 treatment results in an ID surface finish that is highly durable. The DP3 process is available on probes with inside diameters down to 0.016” in flush or angle-cut tip designs.
When coupled with Diba’s proprietary probe draw down process to reduce tip ID while maintaining a smooth inner surface, DP3 enables precise dispense and aspirate functions for the most demanding new more sensitive diagnostic reagents. Diba application engineers work closely with OEM instrument designers to customise probe manufacturing capabilities according to the needs of each instrument and application.
Do you like or dislike what you have read? Why not post a comment to tell others / the manufacturer and our Editor what you think. To leave comments please complete the form below. Providing the content is approved, your comment will be on screen in less than 24 hours. Leaving comments on product information and articles can assist with future editorial and article content. Post questions, thoughts or simply whether you like the content.
In this edition Articles - Detection of molecular markers in aquatic sediments by ion profi les obtained by GC/MS system - Fighting the Resistance: How Rapid Microbial ID with MALDI MS and A...
View all digital editions
Feb 20 2019 Mumbai, India
Feb 21 2019 New Delhi, India
Feb 25 2019 Moscow, Russia
Feb 26 2019 Guangzhou, China
Feb 27 2019 Berlin, Germany