MFD Plus – Full Scale Flow extended to 20‘000 sccm

The trusted Axetris Plus range of mass flow meters and controllers are now available for flow control upto 20’000 sccm.

Axetris is delighted to announce a further extension to its MFD Plus range of mass flow meters and controllers. The products are now available with Nitrogen, Air or Argon calibrations for full scale flows of upto 20 slpm.

They provide an unmatched dynamic range of better than 2500:1. The new innovation from Axetris allows you to use a single mass flow device over a wide range of flow rates, helping you save costs, while taking the complexity out of design and logistics. The Plus range of mass flow devices come in surprisingly compact sizes, enabling compact designs.

Your Applications

• Analytical Instruments

• Leak Testing

• Thin Film Coating

Our Strengths

• Unmatched Dynamic Range

• Excellent Repeatability

• Miniature Size

• Designed for OEMs

Technical Specifications at a Glance

Typical Value*

Flow Range: 0 – 20‘000 sccm¹

Flow Accuracy: ± 0.2 % F.S.² / ± 1 % O.R.³ whichever is greater

Repeatability: ± 0.015 % F.S.² / ± 0.15 % O.R.³ whichever is greater

Resolution: 0.01% F.S.²

Dimensions: 50 x 22 x 52 mm (OEM Mass Flow Controller)

* For specific details, please consult product datasheet

¹ sccm = standard cubic centimeters per minute

² Full Scale

³ Of Reading

For F.S.>15’000 sccm, specified accuracy is +/- 2.5% O.R. / specified repeatability is +/- 0.2% O.R.

Standard F.S. with N2 calibration, max. F.S. available with other gases, please contact Axetris.

About Axetris Mass Flow Meters and Controllers

Axetris offers OEM mass flow meters (MFM) and controllers (MFC) which offer outstanding value to the customer. The proprietary, platinum-based MEMS chip technology guarantees excellent accuracy and repeatability in combination with high speed and an extended dynamic range. The Axetris mass flow technology is used by many leading companies in the fields of gas chromatography, leak testing, thermal analytics, mass spectroscopy, thin film deposition, plasma engineering and­ more.